Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef
Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad
Electronics Forum | Fri Apr 21 23:17:29 EDT 2006 | SD
Well, my first thought is that you need to consider lead-free rework. Depending on the alloy, some stations may not be able to reach the correct temperature. The best stations I have seen have a prism & shows both the pads and the BGA on a single v
Electronics Forum | Thu Oct 30 00:12:13 EST 2003 | Grant Petty
Hi, Another option we have used here in house is to remove the unwanted BGA balls with solder wick, and then to manually place them on the PCB foot print. This eliminates the pick and place machine's optical centering freaking out because the balls
Electronics Forum | Tue Apr 11 20:31:54 EDT 2000 | Dave F
Russ: You�re correct. I should have explained our reasons for preferring concave over convex better. First, we use both also ... we just prefer concave because they: * Don�t bridge any where near as easily. * Self-center better. * Seem to have mor
Electronics Forum | Sat Mar 24 03:06:55 EDT 2007 | aj
Hi Mika, We came across some difficulties with this type of device a couple of years back . After the proto run we needed to touch up the outside fillets to get stability and product to pass test. ( even though the manf. stated that there is no fill
Electronics Forum | Sat Jan 23 09:36:35 EST 1999 | Parvez Patel
Hi Everyone, We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concerns fo
Electronics Forum | Fri Apr 08 08:35:44 EDT 2005 | Grant
Hi, What are you doing for reflow. Sounds like a cheap MYDATA TP machine second hand might do the trick, but don't know if it could do 0201 though. You can get a fairly ok manual stencil printer that might do the trick. We had one that had a linear
Electronics Forum | Tue May 03 15:19:12 EDT 2005 | cuculi54986@yahoo.com
Thanks for the suggestions. We have been going around the dome to pick from the base. The placement machines are Panasonic chipshooters - MV2VB and MV2C. I have several problems with the MV2C. The K-type feeder plates were moved by my predeces
Electronics Forum | Sat Oct 28 10:40:54 EDT 2006 | grantp
Hi, I totally agree. If I purchased a machine, and a company wanted me to pay some kind of fee just to be able to purchase parts, I would go nuts. What a terrible policy. I think, and this is becoming more common, that companies are becoming so sel
Electronics Forum | Wed Jul 09 14:47:39 EDT 2014 | deanm
I'm looking for a typical SMT placement defect rate from others in the field so I can judge whether or not we are in an acceptable range. If I give you a board with 200 components (0603, 0805, SOICs, 20mil MSOPs, tantalums, DPAKs and a few 20mil fin
